Chipboard manufacturer Egger (UK) Ltd has supplied 18,000 heavy-duty HDX panels for a “walk-on” ceiling application at a mobile phone company’s new test centre.
More than 470m2 of HDX P6 high-density 38mm thick board was chosen for T-Mobile’s radio frequency test centre at Borehamwood, Hertfordshire, because of its load-bearing and strength properties, plus cost-effectiveness. Specifiers said the board had to be strong enough to protect ground floor equipment in the event of a roof collapse.
Craig Colligan, Egger product controller, said: “The contract is a major success for our HDX product range in a competitive market place and reinforces our ability to provide a top quality and cost-competitive product for demanding industiral applications.”
Egger HDX is specifically designed for applications requiring a hard-wearing floor and features a double chamfered tongue and groove profile for easy installation.
